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  1. www.ChipScaleElectronics.com - chip scale electronics - CSP - chip scale packaging - BGA CSP packaging

    Chip Scale Electronics directory from the publishers of OEM Technology News & Electronic Assembly News. Free sample copies offered on this site.
    CSP1
    CHIP SCALE1
    chip scale packaging1
    SEMICONDUCTOR FABRICATION1

    www.chipscaleelectronics.com - 2009-02-04

  2. NxGEN Electronics; It's in the name.

    NxGen Electronics, Advanced Packaging Technologies
    CSP1
    BGA1
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    chip scale technology1
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    NxGen1
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    Nexgen Electronics1
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    NxGen Electronics1
    Nxgen San Diego1

    www.dodgedemonclub.com - 2009-04-03

  3. TESSERA TECHNOLOGIES

    UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
    MCP2
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    CSP1
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    multi-chip package1
    package stacking1

    global.tessera.com - 2009-04-09

  4. signal integrity, high speed, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, ...

    3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces ...
    high speed2
    MCP2
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    CSP1
    BGA1
    memory modules1
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    flip chip1
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    advanced packaging1
    chip scale1
    DDR II1
    FBGA1
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    die stacking1
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    fine pitch BGA1
    MBGA1
    power integrity1
    CO design1
    IR drop1
    multi chip1
    reliability modeling1
    cavity down0
    memory stacking0
    multi chip package0
    substrate design0

    www.broadpak.com - 2009-02-11

  5. Welcome to BTU International - The Global Leader in Thermal Technology

    BTU International - Thermal expertise for electronics and materials processing
    Ceramic3
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    Continuous2
    Capacitors2
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    Argon1
    BGA1
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    Annealing1
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    BME1
    Aluminum Brazing1
    Chip Scale1
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    Chip scale packaging1
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    Chip attach1
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    Chip Joining1
    Chip size packaging1
    Continuous Belt Ovens1

    www.atmoplas.com - 2009-02-07

  6. Alchimer: Home

    Alchimer: Enabling technology for economical advancement of semiconductor manufacturing
    packaging3
    copper3
    Insulation2
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    semiconductor2
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    wafer1
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    ECD1
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    nano technology1
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    advanced packaging1
    chip scale1
    electro-plating1
    high density interconnects1
    Diffusion barrier1
    nanometric1
    nano films1
    seed layer1
    stacked die1
    through silicon via1
    chemical-grafting0
    electrografting0
    Glue layer0
    interconnect metallization0
    nanometric film0

    www.alchimer.com - 2009-02-05

  7. Electronics Home Page - Dow Corning

    Dow Corning Electronics is a globally integrated provider of materials, application technology and services.
    service6
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    www.dowcorningelectronics.com - 2009-02-07

  8. XLoom Communications, Chip Scale High Density Optics

    Infiniband,optics,chip scale,wafer level,pluggable,multi port,QSFP,XFP,packaging,InfiniFlame's front-panel pluggability enables populate-as-you-grow of optical ...
    applications6
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    chip scale1
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    QSFP1
    GigaFlame0

    www.xloomcom.com - 2009-02-12

  9. System to ASIC (STA): Analog ASIC, Mixed Signal ASIC solutions

    STA provides low power turn-key Analog ASIC and Mixed Signal ASIC design and production services. Prototypes in 24 weeks.
    Design7
    Digital5
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    Package3
    Telecom3
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    ASIC1
    Wafer1
    CMOS1
    Mixed signal1
    Comparator1
    SOIC1
    Chip scale1
    TSSOP1
    Application specific1

    www.system-to-asic.com - 2009-02-07

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